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3M Double Coated Polyester Tape 442KW, 1/2 in x 36 yds with No Liner
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- Attaches polishing pads to platens for chemical mechanical planarization (CMP) in semiconductor manufacturing
- Rubber based adhesive provides fast, reliable bonding strength and removes cleanly
- Adhesive is applied to film carrier on both sides for effective lamination to pads and clean removal from platens
- Also applicable for polishing pad attachment to platens in HDD and glass manufacturing
- Polyester carrier film helps improve handling for uniform application
- Release liner adds dimensional stability for fast and efficient conversion